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Technology for Thin Film Devices

6 LP

English

#40184 / #1

Seit WS 2015/16

Fakultät IV

HFT 5-2

Institut für Hochfrequenz und Halbleiter-Systemtechnologien

34325800 FG Technologie für Dünnschicht-Bauelemente

Szyszka, Bernd

Szyszka, Bernd

bernd.szyszka@tu-berlin.de

POS-Nummer PORD-Nummer Modultitel
2345860 36284 Technology for Thin Film Devices

Learning Outcomes

The students know the basic properties of the manufacturing of thin film devices and will be able to evaluate them. Futhermore, they know the fundamentals of coating processes, layer stacks and characterizatuin methods as well as applications of thin film devices.

Content

The course covers technological and application oriented aspects of thin film devices. Content of the course are atmospheric pressure and vacuum coating processes, plasma technologies, properties of thin films (electrical, optical and mechanical properties) and their dependance on the film structure, characterization methods and applications of thin film devices.

Module Components

Wahlpflicht:

1 from the following courses must be completed.

Course Name Type Number Cycle Language SWS
Fundamentals of Vacuum and Plasma Process Technologies VL WS/SS No information 2
Industrial Plasma Technologies VL WS/SS No information 2
Seminar Dünne Schichten SEM 3236 L 328 WS/SS No information 2

Pflichtgruppe:

All Courses are mandatory.

Course Name Type Number Cycle Language SWS
Technology of Thin Film Devices VL 0431 L 007 WS/SS No information 2

Workload and Credit Points

Technology of Thin Film Devices (VL):

Workload description Multiplier Hours Total
Präsenszeit 15.0 2.0h 30.0h
Vor-/Nachbereitung 15.0 4.0h 60.0h
90.0h (~3 LP)

Fundamentals of Vacuum and Plasma Process Technologies (VL):

Workload description Multiplier Hours Total
Präsenzzeit 15.0 2.0h 30.0h
Vor-/Nachbereitung 15.0 4.0h 60.0h
90.0h (~3 LP)

Industrial Plasma Technologies (VL):

Workload description Multiplier Hours Total
Präsenzzeit 15.0 2.0h 30.0h
Vor-/Nachbereitung 15.0 4.0h 60.0h
90.0h (~3 LP)

Seminar Dünne Schichten (SEM):

Workload description Multiplier Hours Total
Präsenzzeit 15.0 2.0h 30.0h
Vor-/Nachbereitung 15.0 4.0h 60.0h
90.0h (~3 LP)
The Workload of the module sums up to 180.0 Hours. Therefore the module contains 6 Credits.

Description of Teaching and Learning Methods

Das Wissen wird anhand von Vorlesungen und Seminaren vermittelt. Die Vorlesungsteilnehmer_innen organisieren sich in Gruppen, die semesterbegleitend selbständig vorgegebene Themen bearbeiten.

Requirements for participation and examination

Desirable prerequisites for participation in the courses:

Es werden Kenntnisse in den Grundlagen der Physik und Elektrotechnik erwartet. Grundlagen in der Chemie sind wünschenswert.

Mandatory requirements for the module test application:

No information

Module completion

Grading:

graded

Type of exam:

Oral exam

Language:

English

Duration/Extent:

No information

Duration of the Module

This module can be completed in one semester.

Maximum Number of Participants

This module is not limited to a number of students.

Registration Procedures

Nähere Informationen erhalten Sie unter http://www.tfd.tu-berlin.de und im ISIS-Kurs.

Recommended reading, Lecture notes

Lecture notes

Availability:  unavailable

Electronical lecture notes

Availability:  unavailable

Literature

Recommended literature
Milton Ohring, Materials Science of Thin Films, 978-0-12-524975-1

Module examiner

Prüfungsberechtigte Personen im WS 2019/20: 3

Name
Herr Dr. Ruslan Muydinov
Herr Prof. Dr. Ronald Plath
Herr Bernd Szyszka

Assigned Degree Programs

Zur Zeit wird die Datenstruktur umgestellt. Aus technischen Gründen wird die Verwendung des Moduls während des Umstellungsprozesses in zwei Listen angezeigt.

This module is used in the following modulelists:

Students of other degrees can participate in this module without capacity testing.

This module is used in the following Degree Programs (new System):

    Students of other degrees can participate in this module without capacity testing.

    Miscellaneous

    No information